Electronic Assembly & Testing

Electronic Assembly & Testing

For reliability and repeatability, electronic component assembly is exclusively performed by machine. Artificial Optical Inspection, together with In-circuit and functional tests are performed as required, ensuring the best quality standards.

Substantial continuous investment, ahead of the requirement, ensures the latest state of the art machinery… and the knowledge to use it.

Manufacturing capabilities include:

• BGA & FBGA placement - ball size to 0.2mm and minimum pitch of 0.3mm.
• Automatic Chip on Board bonding.
• SMT components down to 0201.
• Artificial Optical InspectionAOI.
• X-Ray inspection.
• In Circuit TestICT.
• Functional PCBA tests.
• Component defect tracking with real time SPC.
• Lead free double wave-front flow solder and lead free IR reflow with nitrogen generation plant.

Kingtronics, 'Lead free, RoHS ready'
…committed to total customer satisfaction.